John Titizian and Jeff Burger founded Integra Technologies in February 1997 with the goal of redefining the state of the art in S-band power transistors. With the help of Young Kim, PhD. and Apet Barsegyan this goal was realized, culminating in the granting of two US patents in late 2001. This core group of engineers and scientists has worked in the high power RF semiconductor industry since the 1970s, beginning at Power Hybrids, Inc. (PHI)
At its inception, Integra operated using a fabless model, producing die in both Silicon Valley and Asia. After several years it became apparent that the wafer fabrication process would need to be performed onsite to ensure consistent high quality devices. It was at this point that Integra built the largest and most modern all gold metal wafer fab in the world. They now have the capacity to fabricate 250 6â€ (150mm) wafers/month, enough to assemble more than 20,000 devices/month.
Integra Technologies has continued to expand in size and capability and has recently added an additional building adjacent to the primary facility, increasing overall square footage by 50%. This additional space will allow for new automated die attach, wire bonding, and RF test equipment and will enable significant increases in production efficiency and throughput.